LTM4606
ABSOLUTE MAXIMUM RATINGS
(Note 1)
DRV CC , V OUT ................................................ –0.3V to 6V
PLLIN, FCB, TRACK/SS, MPGM, MARG0,
MARG1, PGOOD, RUN ..............–0.3V to INTV CC + 0.3V
V FB , COMP ................................................ –0.3V to 2.7V
V IN , V D ....................................................... –0.3V to 28V
PIN CONFIGURATION
TOP VIEW
Internal Operating Temperature Range (Note 2)
E and I Grades ................................... –40°C to 125°C
MP Grade ........................................... –55°C to 125°C
Junction Temperature ........................................... 125°C
Storage Temperature Range .................. –55°C to 125°C
TOP VIEW
V IN
BANK 1
V D
f SET
MARG0
V IN
BANK 1
V D
f SET
MARG0
PGND
BANK 2
V OUT
BANK 3
SGND
MARG1
DRV CC
V FB
PGOOD
SGND
NC
NC
NC
PGND
BANK 2
V OUT
BANK 3
SGND
MARG1
DRV CC
V FB
PGOOD
SGND
NC
NC
NC
FCB
BGA PACKAGE
133-LEAD (15mm × 15mm × 3.42mm)
T JMAX = 125°C, θ JA = 15°C/W, θ JCbottom = 6°C/W, θ JCtop = 16°C/W
θ JA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS
WEIGHT = 1.9g
ORDER INFORMATION
FCB
LGA PACKAGE
133-LEAD (15mm × 15mm × 2.82mm)
T JMAX = 125°C, θ JA = 15°C/W, θ JCbottom = 6°C/W, θ JCtop = 16°C/W
θ JA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS
WEIGHT = 1.7g
PART NUMBER
PAD OR BALL FINISH
PART MARKING*
DEVICE FINISH CODE
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(Note 2)
LTM4606EV#PBF
LTM4606IV#PBF
LTM4606MPV#PBF
LTM4606EY#PBF
LTM4606IY#PBF
LTM4606IY
LTM4606MPY#PBF
LTM4606MPY
Au (RoHS)
Au (RoHS)
Au (RoHS)
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
SAC305 (RoHS)
SnPb (63/37)
LTM4606V
LTM4606V
LTM4606V
LTM4606Y
LTM4606Y
LTM4606Y
LTM4606Y
LTM4606Y
e4
e4
e4
e1
e1
e0
e1
e0
LGA
LGA
LGA
BGA
BGA
BGA
BGA
BGA
3
3
3
3
3
3
3
3
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–55°C to 125°C
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
? Terminal Finish Part Marking:
www.linear.com/leadfree
? Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
? LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
4606fd
2
For more information www.linear.com/LTM4606
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